Contactless ISO CR-80 13.56MHz smart card (NXP® S50 Standard), without contact chip. MIFARE™ memory with 1 KByte (16 sectors). Made of PVC.
Contactless ISO CR-80 13.56MHz and HID® Prox™ 125 KHz smart card, without contact chip. MIFARE™ memory with 1 KByte (16 sectors). Made of PVC.
Contactless 13.56MHz smart keyfob (NXP® S50 Standard). MIFARE™ memory with 1KByte (16 sectors). Made of PVC
Contactless 13.56MHz smart adhesive tag (NXO® S50 Standard). MIFARE™ memory with 1 KByte (16 sectors). Made of PVC.
Contactless ISO CR-80 13.56MHZ smart card (NCP® S70 Standar) without contact chip. MIFARE™ memory with 4 KBytes (40 sectors). Made of PVC.
Contactless ISO CR-80 13.56MHZ and HID® Prox™ 125 KH smart card (NCP® S70 Standar) without contact chip. MIFARE™ memory with 4 KBytes (40 sectors). Made of PVC.
Contactless 13.56MHz smart Keyfob (NXP® S70 standar). MIFARE™ memory with 4KBytes (40 sectors) Made of PVC.
Contactless 13.56MHz smart ahesive tag (NXP® S70 standar). MIFARE™ memory with 4KBytes (40 sectors) Made of PVC.
Contactless ISO CR-80 13.56MHz smart card without contact chip. DESFire™ EV1 memory with 8 KBytes (flexible memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz and HID® Prox™ 125 KHz smart card without contact chip. DESFire™ EV1 memory with 8 KBytes (flexible memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz and HITAG® Prox™ 125 KHz smart card without contact chip. DESFire™ EV1 memory with 8 KBytes (flexible memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz smart Card without contact chip. MIFARE™ memory with 4KBytes (40 sectors) and DESFire™ EV1 memory with 8 KBytes (flexible memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz smart card (NXP® S50 Standard), without contact chip, made of composite multi-laminated PVC, embeddable (posibility of contact chip insertion). MIFARE™ memory with 1 KByte (16 sectors).
Contactless ISO CR-80 13.56MHz and HID® Prox™ 125 KHz smart card (NXP® S50 Standard), without contact chip, made of composite multilaminated PVC, embeddable (posibility of contact chip insertion). MIFARE™ memory with 1 KByte (16 sectors).
Contactless ISO CR-80 13.56MHz smart card (NXP® S70 Standard), without contact chip, made of composite multi-laminated PVC, embeddable (posibility of contact chip insertion). MIFARE™ memory with 4 KByte (40 sectors).
Contactless ISO CR-80 13.56MHz and HID® Prox™ 125 KHz smart card (NXP® S70 Standard), without contact chip, made of composite multilaminated PVC, embeddable (posibility of contact chip insertion). MIFARE™ memory with 4 KBytes (40 sectors).
Contactless ISO CR-80 13.56MHz smart card, without contact chip, made of composite multi-laminated PVC, embeddable (posibility of contact chip insertion). DESFire™ EV1 memory with 8 KBytes (flexive memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz and HID® Prox™ 125 KHz smart card, without contact chip, made of composite multi-laminated PVC, embeddable (posibility of contact chip insertion). DESFire™ EV1 memory with 8 KBytes (flexive memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz smart card, without contact chip, made of composite multi-laminated PVC, embeddable (posibility of contact chip insertion). MIFARE™ memory with 4 KBytes (40 sectors) and DESFire™ EV1 memory with 8 KBytes (Flexible memory allocations). Made of PVC.
Contactless ISO CR-80 13.56MHz smart card (Standard NXP® S50) without contact chip, with secure element HID® SIO™ enabling MIFARE™ memory. MIFARE™ memory with 1 KBytes (16 sectors).